SOLDER BUMP FORMING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a solder bump forming apparatus which forms solder bumps by heating reflow of cream solder supplied on an electronic circuit board or a silicon wafer substrate formed with an IC, and which is especially suitable for preventing the occurrence of void defects and can prevent void defects. SOLUTION: The solder bump forming apparatus comprises a cream solder printing device which supplies cream solder on a substrate, and a vacuum furnace wherein the supplied cream solder is heated to be reflowed in a vacuum atmosphere in the vacuum furnace to form solder bumps. The use of this solder bump forming apparatus makes it possible to form solder bumps without causing void defects. COPYRIGHT: (C)2004,JPO&NCIPI