| 摘要 |
PROBLEM TO BE SOLVED: To provide a displacement wire bonding type image sensor, shortening a signal transmission distance and increasing a signal transmission speed. SOLUTION: The image sensor is provided with a substrate having a first plate and a second plate composed of a plurality of metal pieces arranged so as to be apart from each other and formed so as to have different heights while a receiving chamber is formed on the bottom surface, an image sensing chip wherein a plurality of bonding pads are formed at positions corresponding to the first plate of the substrate and are installed in the receiving chamber of the substrate while the bonding pads are arrayed so that the positions of them are displaced from the first plate of the substrate, a projected rim layer formed on the peripheral rim and bottom surface of the substrate so as to cover the image sensing chip, a plurality of conductors for electrically connecting the bonding pads of the image sensing chip to the first plate whose position corresponding to the substrate is displaced, and a translucent layer installed on the projected rim layer to cover the image sensing chip. COPYRIGHT: (C)2004,JPO&NCIPI
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