发明名称 |
Semiconductor device and method for fabricating the same |
摘要 |
A semiconductor device according to an embodiment of the invention includes: a trench capacitor formed in a trench in a semiconductor substrate; a transistor for driving the trench capacitor; a semi-cylindrical semiconductor layer in an upper part of the trench constructing a part of a path electrically connecting the trench capacitor and the transistor; and a low-resistant layer buried in the semi-cylindrical semiconductor layer and having resistivity lower than that of the semi-cylindrical semiconductor layer.
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申请公布号 |
US2004164338(A1) |
申请公布日期 |
2004.08.26 |
申请号 |
US20030420758 |
申请日期 |
2003.04.23 |
申请人 |
KOYAMA HARUHIKO |
发明人 |
KOYAMA HARUHIKO |
分类号 |
H01L21/334;H01L21/8242;H01L27/108;H01L29/94;(IPC1-7):H01L27/108 |
主分类号 |
H01L21/334 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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