发明名称 Semiconductor device and method for fabricating the same
摘要 A semiconductor device according to an embodiment of the invention includes: a trench capacitor formed in a trench in a semiconductor substrate; a transistor for driving the trench capacitor; a semi-cylindrical semiconductor layer in an upper part of the trench constructing a part of a path electrically connecting the trench capacitor and the transistor; and a low-resistant layer buried in the semi-cylindrical semiconductor layer and having resistivity lower than that of the semi-cylindrical semiconductor layer.
申请公布号 US2004164338(A1) 申请公布日期 2004.08.26
申请号 US20030420758 申请日期 2003.04.23
申请人 KOYAMA HARUHIKO 发明人 KOYAMA HARUHIKO
分类号 H01L21/334;H01L21/8242;H01L27/108;H01L29/94;(IPC1-7):H01L27/108 主分类号 H01L21/334
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