发明名称 Manufacturing method of semiconductor device
摘要 There are provided a step of forming an insulating film over a semiconductor substrate, a step of exciting a plasma of a gas having a molecular structure in which hydrogen and nitrogen are bonded and then irradiating the plasma onto the insulating film, a step of forming a self-orientation layer made of substance having a self-orientation characteristic on the insulating film, and a step of forming a first conductive film made of conductive substance having the self-orientation characteristic on the self-orientation layer.
申请公布号 US2004166596(A1) 申请公布日期 2004.08.26
申请号 US20030695642 申请日期 2003.10.29
申请人 SASHIDA NAOYA;MATSUURA KATSUYOSHI;HORII YOSHIMASA;KURASAWA MASAKI;TAKAI KAZUAKI 发明人 SASHIDA NAOYA;MATSUURA KATSUYOSHI;HORII YOSHIMASA;KURASAWA MASAKI;TAKAI KAZUAKI
分类号 C23C16/40;H01L21/02;H01L21/314;H01L21/8242;H01L21/8246;H01L27/06;H01L27/105;H01L27/108;(IPC1-7):H01L21/00;H01L21/824 主分类号 C23C16/40
代理机构 代理人
主权项
地址