发明名称 Multilayer board having precise perforations and circuit substrate having precise through-holes
摘要 An intermediate laminated structure is provided including a plurality of unfired ceramic plates stacked along a laminating direction. Each of the plates has a plurality of holes formed therethrough by a punching operation. At least a first hole in one of the plurality of unfired ceramic plates has the same shape and cross-sectional area as respective first holes in the remaining plurality of unfired ceramic plates such that the first holes define a cylinder of constant cross-sectional area throughout the entire thickness of the intermediate laminated structure.
申请公布号 US2004163849(A1) 申请公布日期 2004.08.26
申请号 US20040784558 申请日期 2004.02.23
申请人 NGK INSULATORS, LTD. 发明人 TAKEUCHI YUKIHISA;TSUJI HIROYUKI;KITAMURA KAZUMASA;YAMAGUCHI YOSHINORI
分类号 B26F1/02;B32B38/04;H05K3/00;H05K3/42;H05K3/46;(IPC1-7):H05K1/14;H05K1/03 主分类号 B26F1/02
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