发明名称 |
Multilayer board having precise perforations and circuit substrate having precise through-holes |
摘要 |
An intermediate laminated structure is provided including a plurality of unfired ceramic plates stacked along a laminating direction. Each of the plates has a plurality of holes formed therethrough by a punching operation. At least a first hole in one of the plurality of unfired ceramic plates has the same shape and cross-sectional area as respective first holes in the remaining plurality of unfired ceramic plates such that the first holes define a cylinder of constant cross-sectional area throughout the entire thickness of the intermediate laminated structure.
|
申请公布号 |
US2004163849(A1) |
申请公布日期 |
2004.08.26 |
申请号 |
US20040784558 |
申请日期 |
2004.02.23 |
申请人 |
NGK INSULATORS, LTD. |
发明人 |
TAKEUCHI YUKIHISA;TSUJI HIROYUKI;KITAMURA KAZUMASA;YAMAGUCHI YOSHINORI |
分类号 |
B26F1/02;B32B38/04;H05K3/00;H05K3/42;H05K3/46;(IPC1-7):H05K1/14;H05K1/03 |
主分类号 |
B26F1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|