FLIP CHIP TYPE DEVICE HAVING STRUCTURE OF TRIPLE INPUT/OUTPUT ELECTRODE PAD

摘要

PURPOSE: A flip chip type device having the structure of a tripe input/output electrode pad is provided to reduce the number of fabrication processes and the manufacturing cost by simplifying a layer structure of an input/output electrode pad. CONSTITUTION: An electric device pattern(42) is formed on a wafer(41). An input/output electrode pad(43) is electrically connected to the electric device pattern in order to be connected to a conductive pad of a semiconductor package through a solder bump. The input/output electrode pad includes an electrode layer(43a) formed on the wafer, an adhesive layer(43b) formed on the electrode layer to enhance the interlayer adhesive strength, and an electrode connection layer(43c) formed on the adhesive layer.