发明名称 Reactive gate electrode conductive barrier
摘要 A method, and corresponding transistor structure are provided for protecting the gate electrode from an underlying gate insulator. The method comprises: forming a gate insulator overlying a channel region; forming a first metal barrier overlying the gate insulator, having a thickness of less than 5 nanometers (nm); forming a second metal gate electrode overlying the first metal barrier, having a thickness of greater than 10 nm; and, establishing a gate electrode work function exclusively responsive to the second metal. The second metal gate electrode can be one of the following materials: elementary metals such as p+ poly, n+ poly. Ta, W, Re, RuO2, Pt, Ti, Hf, Zr, Cu, V, Ir, Ni, Mn, Co, NbO, Pd, Mo, TaSiN, and Nb, and binary metals such as WN, TaN, and TiN. The first metal barrier can be a binary metal, such as TaN, TiN, or WN.
申请公布号 US2004164362(A1) 申请公布日期 2004.08.26
申请号 US20040784662 申请日期 2004.02.23
申请人 CONLEY JOHN F.;ONO YOSHI;GAO WEI 发明人 CONLEY JOHN F.;ONO YOSHI;GAO WEI
分类号 H01L29/423;H01L21/28;H01L21/336;H01L21/8238;H01L27/092;H01L29/49;H01L29/78;(IPC1-7):H01L29/76 主分类号 H01L29/423
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