| 摘要 |
PURPOSE: To provide a wiring board which is excellent in the flatness on the surface of a dielectric film and which can obtain a good high-frequency characteristic. CONSTITUTION: A wiring board is provided with an insulation layer and a multilayer interconnection part which is laminated on the insulating layer and contains a first conductor interconnection 11, having an interconnection width of w1 , and a second conductor interconnection 13, having an interconnection width of w2 , which are formed to cross and overlap via an interlayer insulating film. In the intersection of the first conductor interconnection with the second conductor interconnection, the part of the first conductor interconnection within a range of 2 w2 from the center of the second conductor interconnection is set in such a way that the effective interconnection width is less than w1 and that the minimum value of the substantial interconnection width of the first conductor interconnection is at (1/2)w1 or higher (3/4)w1 or lower. |
