发明名称 |
Laser working dielectric substrate and method for working same and semiconductor package and method for manufacturing same |
摘要 |
A dielectric substrate for laser working contains a substance having a size of a half to 10 times of a laser light wavelength and different in refractive index from a material of the dielectric substrate. This substance enhances the absorption of a laser beam. Due to this, the energy loss in laser beam is transformed into the heat of fusion to form a penetration hole, thereby forming a well-formed penetration hole. The substance different in refractive index from the dielectric substrate material uses bubbles when the dielectric substrate is a quartz glass substrate, and a glass bead or fiber when it is a resin substrate. <IMAGE> |
申请公布号 |
EP1246325(A3) |
申请公布日期 |
2004.08.25 |
申请号 |
EP20020006503 |
申请日期 |
2002.03.18 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
OGURA, HIROSHI;YOSHIDA, YOSHIKAZU |
分类号 |
B23K26/00;B23K101/42;H01L23/14;H01S5/02;H01S5/022;H01S5/042;H05K1/03;H05K3/00;H05K9/00 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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