| 摘要 |
A semiconductor device (10A) includes a semiconductor chip (12), a heat dissipation member (14A) for dissipating heat generated by the semiconductor chip (12), and a coupling member (16A) which thermally couples the semiconductor chip (12) to the heat dissipation member (14A), wherein the coupling member (16A) is made of metal and is deformable to absorb stress generated between the semiconductor chip (12) and the heat dissipation member (14A), the coupling member (16A) and the semiconductor chip (12) being joined through metal-metal bonding. <IMAGE> |
