| 摘要 |
PURPOSE: A method for forming a silver thin film as a semiconductor metal line is provided to be capable of improving the uniformity and the adhesive force of the silver thin film by processing a heat treatment after forming a metal seed layer using electroless plating process. CONSTITUTION: A semiconductor substrate(110) is prepared for processing the following processes. After cleaning the semiconductor substrate, the surface of the semiconductor substrate is activated. A metal seed layer(130) is formed on the resultant structure by using an electroless plating solution. A heat treatment is carried out at the resultant structure. A silver thin film(140) is formed on the metal seed layer by carrying out an electrolytic plating process using a silver electrolytic plating solution.
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