| 发明名称 |
Assembly in pressure contact with a power semiconductor module |
| 摘要 |
<p>Sprung connection conductors for connection to tracks on a substrate. A circuit board is arranged outside the housing (10). A pressing piece (50) has a number of pressing elements on its main surface, facing the circuit board (40), for spacing the surface apart from the circuit board.</p> |
| 申请公布号 |
EP1450404(A2) |
申请公布日期 |
2004.08.25 |
| 申请号 |
EP20040000281 |
申请日期 |
2004.01.09 |
| 申请人 |
SEMIKRON ELEKTRONIK GMBH |
发明人 |
GOEBL, CHRISTIAN;LEDERER, MARCO;POPP, RAINER |
| 分类号 |
H01L25/07;H01L23/367;H01L23/40;H01L23/48;H01L25/18;(IPC1-7):H01L23/48 |
主分类号 |
H01L25/07 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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