| 摘要 |
Carrier substrate comprises a conducting layer transparent or quasi-transparent in the visible wavelength region applied to a transparent substrate (1). An independent claim is also included for a process for the production of an electronic component with the carrier substrate. Preferred Features: The conducting layer is a metal oxide selected from InO x: Sn, SnO x: F, SnO x: Sb, ZnO x: Ga, ZnO x: B, ZnO x: F, ZnO x: Al or Ag/TiO x. The conducting layer is applied by CVD, PVD, spray pyrolysis, sputtering or by using a sol-gel process. The conducting layer may be made from a metal, preferably Al, Ag, Au, Ni or Cr. The substrate is made from glass or plastic. |
