发明名称 Integrated circuit trenched features and method of producing same
摘要 A metal processing method is provided for growing a polycrystalline film by preferably chemical vapor deposition (CVD) from a suitable precursor gas or gases on a substrate which has been coated with seeds, preferably of nanocrystal size, of the metal material. The nanocrystal seeds serve as a template for the structure of the final polycrystalline film. The density of the seeds and the thickness of the grown polycrystalline film determine the grain size of the polycrystalline film at the surface of said film. CVD onto the seeds to produce the polycrystalline film avoids the recrystallization step generally necessary for the formation of a polycrystalline film, and thus allows for the growth of polycrystalline films at reduced temperatures.
申请公布号 US6780765(B2) 申请公布日期 2004.08.24
申请号 US20020101905 申请日期 2002.03.19
申请人 GOLDSTEIN AVERY N. 发明人 GOLDSTEIN AVERY N.
分类号 H01L21/288;H01L21/768;H01L23/532;(IPC1-7):H01L21/44 主分类号 H01L21/288
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