发明名称 |
Cooling unit for cooling heat generating component and electronic apparatus containing cooling unit |
摘要 |
A cooling unit comprises a heat sink arranged adjacent to a heat generating component, the heat sink having area dimensions greater than the heat generating component. A heat diffusing member is arranged between the heat generating component and the heat sink. A first heat conducting member is interposed between the heat generating component and the heat diffusing member, and a second heat conducting member is interposed between the heat diffusing member and the heat sink. The heat diffusing member has a thermal conductivity higher than the second heat conducting member and area dimensions greater than the heat generating component.
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申请公布号 |
US6781832(B2) |
申请公布日期 |
2004.08.24 |
申请号 |
US20020085429 |
申请日期 |
2002.02.28 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
NAKAMURA HIROSHI;FUJIWARA NOBUTO |
分类号 |
F25D1/00;G06F1/16;G06F1/20;H01L23/36;H01L23/433;H05K7/20;(IPC1-7):H05H7/20 |
主分类号 |
F25D1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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