发明名称 Cooling unit for cooling heat generating component and electronic apparatus containing cooling unit
摘要 A cooling unit comprises a heat sink arranged adjacent to a heat generating component, the heat sink having area dimensions greater than the heat generating component. A heat diffusing member is arranged between the heat generating component and the heat sink. A first heat conducting member is interposed between the heat generating component and the heat diffusing member, and a second heat conducting member is interposed between the heat diffusing member and the heat sink. The heat diffusing member has a thermal conductivity higher than the second heat conducting member and area dimensions greater than the heat generating component.
申请公布号 US6781832(B2) 申请公布日期 2004.08.24
申请号 US20020085429 申请日期 2002.02.28
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 NAKAMURA HIROSHI;FUJIWARA NOBUTO
分类号 F25D1/00;G06F1/16;G06F1/20;H01L23/36;H01L23/433;H05K7/20;(IPC1-7):H05H7/20 主分类号 F25D1/00
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