发明名称 |
Polycarbosilane adhesion promoters for low dielectric constant polymeric materials |
摘要 |
The adhesion of low k poly(arylene ether) dielectric coating compositions is effectively enhanced by a polycarbosilane promoter additive or primer. A coating composition is prepared by (a) providing a poly(arylene ether) composition; and (b) adding to said composition a small effective adhesion promoting amount of certain polycarbosilanes. The adhesion enhanced coating compositions are cured by heat treatment at temperatures in excess of 50° C. to form a polycarbosilane-modified poly(arylene ether) polymer composition having a low k dielectric constant for use in semiconductor devices.
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申请公布号 |
US6780517(B2) |
申请公布日期 |
2004.08.24 |
申请号 |
US20020163144 |
申请日期 |
2002.06.04 |
申请人 |
HONEYWELL INTERNATIONAL INC. |
发明人 |
CHEN TIAN-AN;GEORGE ANNA M.;LAU KREISTLER S. Y.;WU HUI-JUNG |
分类号 |
C08L83/16;C08G65/40;C08G77/60;C08L71/10;C09D171/00;C09D171/10;C09D183/16;H01B3/30;H01B3/42;H01B3/46;H01L21/312;H01L21/768;H05K3/38;(IPC1-7):C08G77/60;B32B9/00 |
主分类号 |
C08L83/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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