| 摘要 |
Micro electromechanical, MEM, components are created which include at least one integrated circuit die (110p). A cavity in the MEM component modules (300a, 300e) further allows for the flush mounted attachment of component modules when the component modules are stacked to create MEM system structures. Commonly positioned via holes within the component modules provide for communication among the dies (110a, 110b, 110c) on the stacked modules. In one embodiment of the invention, module layers are stacked in an alternating manner that further creates, within in the structure horizontal interlocking slots and vertical chambers. The interlocking slots can be used to join a plurality of structures together and the vertical chambers can be used to draw heat from the structure (400). |
