发明名称 |
Method for manufacturing a multilayer printed circuit board |
摘要 |
A method for manufacturing a multilayer printed circuit board includes providing a core board, a composite foil including a carrier foil, a functional copper foil and a non-reinforced thermosetting resin layer, the functional copper foil being electro-deposited with a uniform thickness of more than 4 mum but less than 10 mum on the carrier foil, the functional copper foil having a front side facing the carrier foil and an opposite backside which is coated with the non-reinforced thermosetting resin layer. The method further involves laminating the composite foil with the non-reinforced thermosetting resin layer on the core board and removing the carrier foil from the functional copper foil in order to uncover the front side of the functional copper foil. A CO2 laser source drills holes from the uncovered front side of the functional copper foil through the functional copper foil and the non-reinforced thermosetting resin layer to form microvias.
|
申请公布号 |
US6779262(B1) |
申请公布日期 |
2004.08.24 |
申请号 |
US20020937085 |
申请日期 |
2002.01.17 |
申请人 |
CIRCUIT FOIL LUXEMBOURG TRADING SARL |
发明人 |
GALES RAYMOND;MICHEL DAMIEN |
分类号 |
H05K3/00;H05K3/02;H05K3/38;H05K3/46;(IPC1-7):H01K3/10 |
主分类号 |
H05K3/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|