发明名称 Semiconductor memory device and test method therof
摘要 A semiconductor memory device employs a power supply system in which a first power supply voltage supplied to a cell area is separated from a second power supply voltage supplied to a peripheral circuit area. Particularly, during a wafer burn-in test operation mode, the first power supply voltage supplied to the cell area is higher than the second power supply voltage supplied to the peripheral circuit area. If a wafer burn-in test operation is performed under the second power supply system, a DC current path formed by a latch-up phenomenon of a memory cell can be shut off.
申请公布号 US6781899(B2) 申请公布日期 2004.08.24
申请号 US20020202272 申请日期 2002.07.24
申请人 SAMSUNG ELECTRONICS, CO., LTD 发明人 HAN GONG-HEUM;KWAK CHOONG-KEUN;NAM HYOU-YOUN
分类号 G01R31/30;G01R31/28;G11C11/413;G11C29/00;G11C29/06;G11C29/12;H01L21/8244;H01L27/10;H01L27/11;(IPC1-7):G11C29/00;G11C7/00 主分类号 G01R31/30
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