发明名称 |
Mounting parts peel suppressing soldering method, electronic circuit baseboard, and electronic instrument |
摘要 |
A method for soldering parts mounted on a print circuit baseboard with Pb-free material. A reflow soldering process is performed to parts mounted on one side surface of the print circuit baseboard. A flow soldering process is then performed to parts mounted on the other side surface of the print circuit baseboard with a jet flow solder process. Either a composition or a melting point of alloys generated when the reflow and flow soldering are performed is differentiated so that the alloy on one side surface does not melt during a flow soldering process to the other side surface.
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申请公布号 |
US6779710(B2) |
申请公布日期 |
2004.08.24 |
申请号 |
US20020133479 |
申请日期 |
2002.04.29 |
申请人 |
RICOH COMPANY, LTD. |
发明人 |
IGARASHI MINORU;MUKAI KATSUHIKO;ISODA MASASHI;KOBAYASHI TAKAYUKI |
分类号 |
B23K1/00;B23K1/08;B23K31/02;B23K101/42;H05K3/28;H05K3/30;H05K3/34;(IPC1-7):B23K31/02 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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