| 摘要 |
Provided are a chemical mechanical polishing apparatus and a method of chemical mechanical polishing using the same in which the clogs of the polishing fluid are prevented from being trapped between the diamond grains embedded in the dresser or removing such clogs already trapped, thereby to prevent a desired lifetime of the dresser from being shortened. Such chemical mechanical polishing apparatus is such that for polishing an object to be polished while feeding a polishing fluid between said object to be polished (semiconductor wafer) and a polishing pad, and has a turn table rotating while holding on the top surface of which a polishing pad; a pressurizing head rotating while holding on the bottom surface of which an object to be polished so as to pressure-contact the object to be polished to the polishing pad; a dresser for refreshing the top surface of the polishing pad by pressure-contacting the bottom surface of which to the polishing pad; and a dresser refreshing means (dresser cleaning unit) for refreshing the dresser during idle period thereof. |
