发明名称 |
Method and apparatus for accessing internal nodes of an integrated circuit using IC package substrate |
摘要 |
A method and apparatus for accessing internal nodes of an integrated circuit using a package substrate are provided. Embodiments of the present invention include an integrated circuit comprising an integrated circuit die comprising a principal side; a conductive element formed on the principal side of the integrated circuit die; a package substrate comprising a principal side facing the principal side of the integrated circuit die; a conductive element located on the principal side of the package substrate; a transmission path wherein a first end of the transmission path is coupled to the conductive element of the integrated circuit die and wherein a second end of the transmission path is coupled to the conductive element of the package substrate.
|
申请公布号 |
US6781218(B1) |
申请公布日期 |
2004.08.24 |
申请号 |
US20030382343 |
申请日期 |
2003.03.04 |
申请人 |
NPTEST, INC. |
发明人 |
WILSHER KENNETH |
分类号 |
H01L23/58;(IPC1-7):H01L39/00 |
主分类号 |
H01L23/58 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|