发明名称 System and method to increase throughput in a dual substrate stage double exposure lithography system
摘要 A lithography system and method are used to increase throughput using multiple reticles to pattern multiple substrates that are positioned with respect to one another according to a predetermined sequence. For example, during a first exposure period a first reticle patterns a first set of substrates, during a second exposure period a second reticle patterns a second set of substrates, during a third exposure period the first reticle patterns a third set of substrates, etc., until all desired substrates are patterned. It is to be appreciate that after the first and second reticles are complete, third and fourth reticles can pattern the first, second, third, etc. sets of substrates.
申请公布号 US6781674(B1) 申请公布日期 2004.08.24
申请号 US20030447200 申请日期 2003.05.29
申请人 ASML HOLDING N.V. 发明人 GALBURT DANIEL;DE KLERK JOS
分类号 H01L21/027;G03B27/32;G03F7/20;G03F9/00;(IPC1-7):G03B27/32;G03B27/42 主分类号 H01L21/027
代理机构 代理人
主权项
地址