发明名称 |
Semiconductor integrated circuit and method of manufacturing the same |
摘要 |
An IC chip comprises a chip peripheral portion and a core macro portion. The chip peripheral portion is made up of a plurality of I/O buffers each of which serves as an interface between the IC chip and the outside thereof, and a plurality of pads to which bonding wires are electrically connected. A CPU core block, peripheral blocks, random logic blocks, and a gate array block are placed in the core macro portion. The respective blocks are electrically connected to one another by metal interconnections. The gate array block designed by a gate array system is layout-designed in accordance with a standard cell system or full custom system together with other blocks.
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申请公布号 |
US6780745(B2) |
申请公布日期 |
2004.08.24 |
申请号 |
US19990377740 |
申请日期 |
1999.08.20 |
申请人 |
OKI ELECTRIC INDUSTRY CO. LTD. |
发明人 |
SHOJI KIMIKATSU;TADOKORO HIROFUMI;YANAGA OSAMU |
分类号 |
H01L27/118;H01L21/82;H01L27/02;(IPC1-7):H01L21/44 |
主分类号 |
H01L27/118 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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