摘要 |
PURPOSE: Provided is a composition including one or more sources of metal ions, an electrolyte, and two or more brightening agents, wherein at least one brightening agent is an organosulfonic acid compound and at least one brightening agent is a dithiocarbonate-containing compound, a method of manufacturing an electronic device, a method of manufacturing an integrated circuit, and a method of depositing a metal layer on a substrate. CONSTITUTION: The composition comprises one or more sources of metal ions, an electrolyte, and two or more brightening agents, wherein at least one brightening agent is an organosulfonic acid compound and at least one brightening agent is a dithiocarbonate-containing compound. The method of depositing a metal layer on a substrate comprises the steps of contacting the substrate with the composition and applying sufficient current density for a period of time to deposit the layer of metal. The method of manufacturing an electronic device comprises the step of depositing a layer of metal on a substrate by contacting the substrate with the composition and applying sufficient current density for a period of time to deposit the layer of metal. The method of depositing a copper layer on a substrate having one or more apertures having a size of 2 μm or less comprises the steps of contacting the substrate with an electroplating composition comprising one or more sources of metal ions, an electrolyte, and two or more brightening agents, and applying sufficient current density for a period of time to deposit the layer of copper, wherein the copper layer has an arithmetic surface roughness of 5 nm or less, as determined by atomic force microscopy.
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