METHOD FOR MOLDING BOTH SIDES OF PCB MODULE HAVING WAFER LEVEL PACKAGE AND MOLD USED FOR THE SAME

摘要

PURPOSE: A method for molding both sides of a PCB module having a wafer level package and a mold used for the same are provided to enhance the productivity by molding simultaneously the top surface and the bottom of a PCB. CONSTITUTION: A wafer level package including a semiconductor chip having a bumper is prepared. A PCB module is formed by mounting wafer level packages having bumpers on the top surface and the bottom surface of a PCB(107). The PCB module is loaded between an upper mold including an upper cavity and an upper gate and a lower mold including a lower cavity and a lower gate. Epoxy molding compound(129) is implanted into the upper cavity and the lower cavity through an implantation part adjacent to the upper gate and the lower gate. The PCB module is separated from the upper mold, the lower mold, and the implantation part. The residual epoxy molding compound is removed from the implantation part.