发明名称 |
PROCESSING A MEMORY LINK WITH A SET OF AT LEAST TWO LASER PULSES |
摘要 |
<p>A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 500 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single "pulse" by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.</p> |
申请公布号 |
KR20040073958(A) |
申请公布日期 |
2004.08.21 |
申请号 |
KR20037010094 |
申请日期 |
2003.07.30 |
申请人 |
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发明人 |
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分类号 |
B23K26/00;H01L21/82;B23K26/06;B23K26/067;B23K101/38;G11C17/14;H01L21/8242;H01L23/525;H01L27/10;H01L27/108;H01S3/00;H01S3/09 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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