Semiconductor case, has frame constituting spaced out electrical connection pins on front surface with integrated chip having wires, grooves, balls and other set of pins connected to pins on front surface

摘要

The case has a frame constituting spaced out electrical connection pins on a front surface. An integrated circuit chip is fixed to the front face. Electrical connection wires (16), electrical connection grooves (39), electrical connection balls (40) and other set of electrical connection pins of the chip are connected to the electrical connection pins on the front surface and a unit comprising a block and ring.