发明名称 SUBSTRAT OU STRUCTURE DEMONTABLE ET PROCEDE DE REALISATION
摘要 <p>The invention relates to the preparation of a thin layer comprising a step in which an interface is created between a layer used to create said thin layer and a substrate, characterized in that said interface is made in such a way that it is provided with at least one first zone (Z1) which has a first level of mechanical strength, and a second zone (Z2) which has a level of mechanical strength which is substantially lower than that of the first zone. Said interface can be created by glueing surfaces which are prepared in a differentiated manner, by a layer which is buried and embrittled in a differentiated manner in said zones, or by an intermediate porous layer.</p>
申请公布号 FR2823596(B1) 申请公布日期 2004.08.20
申请号 FR20010005129 申请日期 2001.04.13
申请人 COMMISSARIAT A L&apos,ENERGIE ATOMIQUE 发明人 ASPAR BERNARD;MORICEAU HUBERT;ZUSSY MARC;RAYSSAC OLIVIER
分类号 H01L21/02;H01L21/68;H01L21/762;H01L21/78;H01L27/12;(IPC1-7):H01L21/30;H01L23/32 主分类号 H01L21/02
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