| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment method wherein a substrate with a resist film formed thereon is so heat-treated as to realize a circuit pattern excellent in geometric accuracy, and to provide a heat treatment apparatus. SOLUTION: The heat treatment method comprises a step of placing a wafer W, with a film formed on its surface by resist liquid application, on a hot plate 33 housed in a heat treatment chamber 31; a step of controlling the vaporization rate of a specified substance in the film by changing the volume of the heating chamber 31 during the heating of the wafer W for the specified substance to have a distribution in the direction of the thickness of the film; and a step of transferring the wafer W from the hot plate 33 to a cooling plate 43 for cooling. COPYRIGHT: (C)2004,JPO&NCIPI
|
