发明名称 SURFACE TREATMENT DEVICE AND METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a surface treatment device and method therefor capable of carrying out a uniform surface treatment even to a substrate with a large area larger than 1m×1m by uniformly generating a plasma between a non-ground electrode and a grounded electrode. SOLUTION: In this surface processor 50 for treating the surface of a substrate arranged in a vacuum container by using a plasma, coaxial cables 100a to 100h used for a power supply system for generating the plasma are constituted of non-flexible first coaxial cables 101a to 101h and 103a to 103h and flexible second coaxial cables 102a to 102h. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004235380(A) 申请公布日期 2004.08.19
申请号 JP20030021255 申请日期 2003.01.30
申请人 MITSUBISHI HEAVY IND LTD 发明人 MURATA MASAYOSHI;YAMADA AKIRA;BABA TOMOYOSHI
分类号 C23C16/505;H01L21/205;(IPC1-7):H01L21/205 主分类号 C23C16/505
代理机构 代理人
主权项
地址