发明名称 |
SURFACE TREATMENT DEVICE AND METHOD THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a surface treatment device and method therefor capable of carrying out a uniform surface treatment even to a substrate with a large area larger than 1m×1m by uniformly generating a plasma between a non-ground electrode and a grounded electrode. SOLUTION: In this surface processor 50 for treating the surface of a substrate arranged in a vacuum container by using a plasma, coaxial cables 100a to 100h used for a power supply system for generating the plasma are constituted of non-flexible first coaxial cables 101a to 101h and 103a to 103h and flexible second coaxial cables 102a to 102h. COPYRIGHT: (C)2004,JPO&NCIPI
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申请公布号 |
JP2004235380(A) |
申请公布日期 |
2004.08.19 |
申请号 |
JP20030021255 |
申请日期 |
2003.01.30 |
申请人 |
MITSUBISHI HEAVY IND LTD |
发明人 |
MURATA MASAYOSHI;YAMADA AKIRA;BABA TOMOYOSHI |
分类号 |
C23C16/505;H01L21/205;(IPC1-7):H01L21/205 |
主分类号 |
C23C16/505 |
代理机构 |
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代理人 |
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地址 |
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