SEMICONDUCTOR WAFER, SEMICONDUCTOR CHIP, AND METHOD OF DETECTING STAMP

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor wafer that causes no fall of its productive efficiency even when a wide-gap semiconductor is used as a substrate, and to provide a semiconductor element. SOLUTION: The semiconductor wafer is provided with the substrate 11 having a first stamp 10 formed on its rear surface and composed of the wide-gap semiconductor; a transparent deposited layer 12 which is formed on the substrate 11, is composed of the wide-gap semiconductor or insulator, and is transparent to visible light; and an opaque layer 13 which is formed on the deposited layer 12 and is opaque to visible light. The wafer is also provided with a thin film layer 14 which is formed on the rear surface of the substrate 11 and is opaque to visible light. The first stamp 10 and the opaque layer 13 do not overlap each other in the top view of the wafer. Since the first stamp 10 can be detected from the upside of the substrate 11, it becomes unnecessary to turn upside down the wafer for detecting the stamp 10 during the manufacturing process of the wafer. COPYRIGHT: (C)2004,JPO&NCIPI