| 摘要 |
PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition bringing out a laminate and a wiring board having a low dielectric loss tangent, a high elastic modulus, little warping when constituting built up, high heat resistance and high Tg, suppressing interlaminar separation which occurs in punching processing and excellent in breaking resistance, etc., by small-sized drill and attaining flame retardant specification UL94V-0 without using a flame retardant of a halogen-based or an antimony compound. SOLUTION: The thermosetting resin composition comprises (A) a thermosetting resin having a dihydrobenzoxazine ring, (B) a modified phenol resin and (C) an epoxy resin in which an epoxy resin (C1) having 25,000-50,000 weight average molecular weight and 2,500-5,000 g/eq epoxy equivalent is contained, as main components and as necessary, further comprises (D) inorganic filler, (E) a condensed phosphate and (F) an epoxydized polybutadiene. COPYRIGHT: (C)2004,JPO&NCIPI |
