| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding method for electronic parts and apparatus therefor capable of effectively solving problems upon pressure welding, by effectively pressurizing the top surfaces of electronic parts individually with uniform pressure without forming any gap by using an electronic parts pressure-welding means to a substrate to include a plurality of semiconductor chips being the electronic parts at a predetermined position. SOLUTION: The bonding apparatus for electronic parts includes the electronic parts pressure-welding means 1 composed of a pressing mechanism 3 and a pressurizing/equalizing mechanism 4. Further, a plurality of the semiconductor chips 2 and the substrate 5 are effectively pressure-welded by using the pressure-welding means 1 in the state where the top surfaces of the plurality of the semiconductor chips 2 are pressed corresponding to the heights thereof, and the top surfaces of the plurality of the semiconductor chips 2 can be pressurized uniformly, effectively, and individually without causing the gap with the aid of the pressurizing means 1, thereby, the problems upon the pressurization of the plurality of the chips 2 and the substrate 5 can be solved effectively. COPYRIGHT: (C)2004,JPO&NCIPI
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