| 摘要 |
The invention relates to a vertical-probe testing head (100), of a type that comprises at least a first and a second plate-like holder (12A, 12B) respectively provided with at least one guide hole (13A, 13B) for receiving at least one contact probe (14), having at least one contact tip (15) adapted to establish mechanical and electrical contact to a corresponding contact pad (16) of an integrated electronic device (17) to be tested and being deformed in a deflection region (22) of the probe (14) located between the plate-like holders (12A, 12B) as the contact tip (15) abuts onto the contact pad (16). Advantageously in this invention, the contact probe (14) has, located at said contact tip (15), at least one rigid arm (20) extending laterally from a body (21) of the contact probe (14) and terminating in the contact tip (15). In particular, the rigid arm (20) is adapted to offset a contact point of the probe (14) with its corresponding contact pad (16) from a longitudinal axis (A-A) of the contact probe (14). <IMAGE> |
