CONDUCTIVE PAD HAVING ADDED SILICON AND TEFLON COATING LAYERS

摘要

PURPOSE: A conductive pad having added silicon and Teflon coating layers is provided to improve insulation, reduce a defect rate, and improve stability, durability and work efficiency of bonding. CONSTITUTION: Silicon layers(20) are formed on the upside and the bottom of a conductive sheet(10) to remove a phenomenon that carbon particles come out in a pressurizing process and to make volume resistance regular. Teflon layers(30) are formed on the upside and the bottom of the silicon layers to prevent the conductive sheet from being stuck to an equipment or printed circuit board. Mica layers(40) are laminated on the upside and the bottom of the Teflon layers.