发明名称 RESIN FOR PHOTORESIST AND PHOTORESIST COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin permitting manufacture of a photoresist having excellent transparency to radiations, especially KrF excimer lasers, resolution, sensitivity, heat resistance and plasma etching resistance as a chemical sensitization type resist and giving rectangular photoresist patterns with high reproducibility. <P>SOLUTION: The resin consists of a novolak type phenol resin obtained by reacting specified phenols with aldehydes in the presence of an acid catalyst, with a part of hydroxyl groups of the resin protected with a group capable of leaving under an action of an acid, and the phenols preferably contain terpene diphenol derived from limonene and pyrogallol. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004231858(A) 申请公布日期 2004.08.19
申请号 JP20030023844 申请日期 2003.01.31
申请人 SUMITOMO BAKELITE CO LTD 发明人 IMAMURA YUJI
分类号 G03F7/039;C08G8/10;H01L21/027 主分类号 G03F7/039
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