| 摘要 |
PROBLEM TO BE SOLVED: To suppress the vertical vibration of a substrate when the substrate is rotated. SOLUTION: An untreated wafer W is placed on the supporting surfaces 122A of three supporting members 12. After the wafer W is placed on the surfaces 122A, a pinching member 13 rotates around its shaft 131 and pinches the wafer W. When the upper inclined surface 136A of a pinching section 133 comes into contact with the upper edge of the end face of the wafer W and, thereafter, the pinching member 13 further rotates during this curse; the upper edge of the end face of the wafer W is pressed down by the upper inclined surface 136A. In addition, the lower edge of the end face of the wafer W comes into contact with the lower inclined surface 136B of the pinching section 133, and the end face of the wager W is pinched by the upper and lower inclined surfaces 136A and 136B from above and below. Consequently, the wafer W is held in an almost horizontal attitude by a spin chuck 1, because the wafer W is supported by the three supporting members 12 from below and pressed by the three pinching members 13 from above between each supporting member 12. COPYRIGHT: (C)2004,JPO&NCIPI |
