摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method, by which a chipping, a chip flying and a defective chip size are prevented when an RIG film is cut. SOLUTION: A rare earth iron garnet film manufactured by a liquid-phase epitaxial method is stuck on a substrate by using an ultraviolet irradiation peeling type adhesive tape, and cut by using a peripheral cutting edge type dicing machine to manufacture a Faraday rotator. In the above method, a dicing blade used in the case of a cutting is made by an electroforming, the diameter of a used diamond abrasive grain is kept within a range of 2 to 6μm, the diameter of the outside diameter of the dicing blade is formed in 50 to 70 mm, the thickness of the dicing blade is formed in 20 to 50μm, and the density of the diamond abrasive grain is set in 60 to 20%. COPYRIGHT: (C)2004,JPO&NCIPI |