| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for cleaning a mold capale of enhancing mold cleaning workability. SOLUTION: A fabric 5 is set at the place where a lead frame 4 is set in a semiconductor sealing mold 1 and the resin composition 2 for cleaning the mold is injected in the semiconductor sealing mold 1 in this state and molded. The interior of the semiconductor sealing mold 1 is cleaned by demolding a molded article 3 from the semiconductor sealing mold 1. The resin composition 2 contains an amino resin and a mineral substance powder, and the content of the mineral substance powder is 5-30 mass % with respect to the whole amount of the resin composition. The content of the mineral substance powder with the maximum particle size of 180μm or below and a particle size of 100μm or above is 1 mass % or below with respect to the whole amount of the resin composition. COPYRIGHT: (C)2004,JPO&NCIPI
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