发明名称 |
PLATING DEVICE AND METHOD |
摘要 |
There is provided a plating device that can easily form a uniform plated film on the surface, to be plated, of a material. The plating device includes: a holder for holding a material with its surface, to be plated, upward and its peripheral portion of the surface, to be plated, sealed; a heated fluid holding section for holding a heated fluid which is allowed to come into contact with the back surface of the material held by the holder to heat the material; and a plating solution supply section for supplying a plating solution to the surface, to be plated, of the material held by the holder. |
申请公布号 |
WO03014416(A3) |
申请公布日期 |
2004.08.19 |
申请号 |
WO2002JP08213 |
申请日期 |
2002.08.12 |
申请人 |
EBARA CORPORATION;HONGO, AKIHISA;WANG, XINMING;MATSUDA, NAOKI |
发明人 |
HONGO, AKIHISA;WANG, XINMING;MATSUDA, NAOKI |
分类号 |
C23C18/16;H01L21/288;H01L21/768 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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