| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow device firstly capable of uniformly heating a wiring board without irregular temperature distribution, secondly excellent in heating efficiency and operational cost, and thirdly, excellent in facility cost by a compact and simple configuration. SOLUTION: The reflow device 4 heats a wiring board A with an electronic component C mounted thereon via precoated solder B by blowing hot air thereagainst while carrying the board, and solder-packages the electronic component C on the wiring board A with molten solder B. The reflow device has a honeycomb heater 9, and the honeycomb heater 9 has a honeycomb structure with metal flat plates and metal corrugated plates wound therearound in multiple layers, and spaces between the layers are insulated by insulating films. Air flow by a fan 1 can be straightened, and, at the same time, the flat plates and corrugated plates are energized in the winding direction to generate heat. The passing air flow can be heated, and hot air is blown against the wiring board A. COPYRIGHT: (C)2004,JPO&NCIPI |
