发明名称 THICK FILM PART REMOVING DEVICE AND THICK FILM PART REMOVING METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a thick film part removing device which can easily and stably remove a thick film part appeared at the time of application starting or application ending when a coating liquid is applied onto continuously conveyed band-shaped supports, and to provide a thick film part removing method using the same. SOLUTION: When the coating liquid is applied onto the continuously conveyed band-shaped supports by using a coater, the thick film part removing device is arranged on a downstream side of the applying position and on an upstream side of an applied film drying part and removes the thick film part appeared when the coater is relatively come into contact with the band-shaped support and parted. The thick film part removing device has an initial winding roll of a wiping member wound in a roll shape, a pushing roll for pushing the wiping member to the band-shaped support and a winding up roll of the wiping member and a tension roll is provided between the initial winding roll and the pushing roll. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004230257(A) 申请公布日期 2004.08.19
申请号 JP20030020328 申请日期 2003.01.29
申请人 KONICA MINOLTA HOLDINGS INC 发明人 MINAMINO DAIKI
分类号 B05D3/12;B05C1/08;B05C11/10;(IPC1-7):B05C11/10 主分类号 B05D3/12
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