发明名称 HEAT EXCHANGER, COOLING SYSTEM, AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide heat exchanger having high heat exchangeability, mountable on a specified apparatus in a saved space, a cooling system having the heat exchanger and allowing the easy maintenance and replacement of parts at low cost, and electronic equipment in the heat exchanger in which holes are made in a heat transfer plate and pipes are passed through the holes, the cooling system in which external heat is removed by passing therethrough refrigerant flowing through the pipes, and the electronic equipment such as a personal computer and a server having the cooling system in which the heat of electronic elements such as a CPU is removed by passing therethrough the refrigerant flowing through the pipes. SOLUTION: This heat exchanger comprises the heat transfer plate 211 having the plurality of holes therein and the pipe group having the plurality of individally erectable pipes 221, 222, 223, and 224 passed through the plurality of holes formed in the heat transfer plate 211. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004232923(A) 申请公布日期 2004.08.19
申请号 JP20030020377 申请日期 2003.01.29
申请人 FUJITSU LTD 发明人 GI KETSU
分类号 F25D9/00;F28F1/32;H01L23/473;H05K7/20;(IPC1-7):F28F1/32 主分类号 F25D9/00
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