| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for high frequency circuit which dose not cause resonance and transmission and is superior in high frequency characteristics and reliability. SOLUTION: An electromagnetic wave absorber which is bonded to an inner part of the package for high frequency circuit and suppresses cavity resonance is composed of a compound material of resin and soft magnetic powder. A metallic film is provided to a bonding face, and surface roughness is set to be 0.05 to 0.20μm. COPYRIGHT: (C)2004,JPO&NCIPI |
