| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board having excellent laser workability and high bendability flexure property strength. SOLUTION: A non-woven fabric including a copper foil and resin adhering to an insulating substrate including a first circuit formed on the insulating substrate on the opposite sides of the insulating substrate is disposed such that the copper foil is located outside. A via hole is formed in an insulating layer obtained by curing the non-woven fabric involving the resin adhering thereto after the copper foil and the resin are bonded to the non-woven fabric with the aid of a vacuum pressurizing laminator, and then interlayer connection of the via hole is achieved by copper plating for multilayering. Further, a resin-equipped non-woven fabric containing B stage resin with high resin fluidity is multilayered and bonded with the aid of the vacuum pressurizing laminator. Moreover, the formation of the insulating layer is ensured by the vacuum pressurizing laminator, and hereby the multilayer wiring board having excellent laser workability and high bendability is ensured. COPYRIGHT: (C)2004,JPO&NCIPI |
