发明名称 COVER TAPE FOR PACKAGING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a cover tape, which can be heat welded with sufficient adhesive strength to a plastic carrier tape, regardless of the differences of the material of the carrier tape, and has superior transparency. SOLUTION: The cover tape for packaging electronic components can be heat sealed on the plastic carrier tape, on which a series of housing pockets for housing the electronic components are formed. The cover tape is composed of at least two layers consisting of a heat sealing material layer (abbreviated to layer B hereafter) and a base layer, which are formed to put the layer B on the top of the base layer on the surface of the cover tape that is heat sealed on the carrier tape. The layer B is made of a compound composed mainly of ethylene-vinyl acetate-anhydrous maleic acid ternary copolymers or ethylene-ethyl acrylate-anhydrous maleic acid ternary copolymers. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004231226(A) 申请公布日期 2004.08.19
申请号 JP20030021405 申请日期 2003.01.30
申请人 SUMITOMO BAKELITE CO LTD 发明人 HIRAMATSU MASAYUKI
分类号 B65D73/02;B32B27/28;B65D85/86;(IPC1-7):B65D85/86 主分类号 B65D73/02
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