发明名称 PROBE CARD AND METHOD OF INSPECTING SEMICONDUCTOR CHIP
摘要 PROBLEM TO BE SOLVED: To provide a probe card on which probes can be formed at a high density and, at the same time, a decoupling capacitor used for cutting high-frequency noise is disposed near by the probes. SOLUTION: The probe card which is used for testing the electrical characteristics of an electronic circuit by bringing the probes into contact with the electrodes of a semiconductor wafer or chip to be inspected contains a first wiring board and a second wiring board mounted of the first wiring board, so as to form a gap between the first and second wiring boards. The probes are provided on the second wiring board, and at least the decoupling capacitor is mounted on the second wiring board in the gap on the opposite side of the probe attaching surface of the second wiring board. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004233155(A) 申请公布日期 2004.08.19
申请号 JP20030020663 申请日期 2003.01.29
申请人 FUJITSU LTD 发明人 YAMAGISHI YASUO
分类号 G01R1/073;G01R1/067;G01R31/28;H01L21/66;(IPC1-7):G01R1/073 主分类号 G01R1/073
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