Electronic device having a stack of semiconductor chips and method for the production thereof

摘要

The invention relates to an electronic device having a stack of semiconductor chips, and to a method for the production thereof. A first semiconductor chip is arranged on a rewiring substrate, and at least one semiconductor stack chip is arranged on the first semiconductor chip. A rewiring plane is arranged between the semiconductor chips. The contact areas of the semiconductor chips are connected to external contacts of the device by the rewiring plane and the rewiring substrate.