PRESSURE-SENSITIVE ADHESIVE TAPE FOR PASTING WAFER THERETO

摘要

A pressure-sensitive adhesive tape for pasting a wafer thereto having a base material and, formed on the surface thereof, a radiation-curable pressure-sensitive adhesive layer, and optionally an adhesive layer for adhering a die, wherein the radiation-curable pressure-sensitive adhesive layer comprises, as a main component, an acrylic copolymer comprising, on its main chain, a group having a radiation-curable carbon-carbon double bonding, a group having a hydroxyl group and a group having a carboxyl group, and has a gel content of 60 % or more.